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Semiconductor · Materials
Substrate
CSP substrates using flip-chip bonding for faster data transmission. FCCSP, thin CSP and build-up CSP.
FCCSP
Overview
- A CSP substrate utilizing conductive solder bumps for electrical connection between die and substrate
- Suitable for faster data transmission by using flip chip bonding
Feature
- Array type lead free solder bump and stack ball
- Build - up technology plating available
- Stack via available
- MLCC embedding
Thin CSP
Overview
- Multi Chip Packages require thinner substrates to stack more chips in a single package.
Feature
- 80
100um total thickness using 3540um laminates - For proper handling of thin substrates, special guide can be applied
- Flat surface
- Via available (Cu filled)
Build - up CSP
Overview
- High Functionality High Density packages using HDI build - up lamination
- We use standard materials and laser drilling to create leading technology, multi-layer, high density package substrates.
Feature
- High density build-up structure
- Via fill plating available
- Stack via available
BOC
Overview
- Fine Line Technology enables high speed DDR DRAM to reduce signal noise by using a short electrical path
Feature
- Slot Fabrication by Router of Punching without additional shaving
- Fine Line Technology(L/S=25㎛/25㎛)by subtractive process or MSAP process
- Dual substrates process available
- Multi Layer Process available