Company

History

1. 2026

   • Partnership with ELEVEN ELECTRONICS — tape (EMI, QFN, RM removal, dicing) and equipment (automation tunnel oven, PMC oven, skeleton wafer management, wafer ring frame cleaning, tape lamination, X-ray fluorescence measuring, flatness)

2. 2023

   • Partnership with SP TECH for flux cleaning chemical, GST for flux clean equipment, and AKOCHEM for automotive release agent
   • Partnership with LB Semicon for bumping and back-end packaging

3. 2021

   • Partnership with SK pucore; automotive chemical business established for Hyundai Automotive and Autocom in Vietnam and Indonesia
   • Partnership with KORNIC — dicing blade saw machines, auto wafer mounters and more

4. 2018

   • Partnership with CNI, a global leader in sputtering systems

5. 2017

   • Partnership with KX Hitech for JEDEC trays

6. 2013

   • Partnership with KCC and Synapse Imaging Co., Ltd.

7. 2010

   • Partnership with DAEDUCK Electronics, a global top-tier substrate manufacturer

8. 2008

   • Awarded the Korea Prime Minister Prize for export of Korean products
   • Partnership with DUKSAN Hi-Metal, the world's second largest solder ball manufacturer

9. 2007

   • Achieved SBS (Small & Medium Business Representative in Singapore) from Korea
   • Partnership with SEMES (Secron) for saw singulation equipment

10. 2006

    • Company established in Singapore
    • Acquired representative role for SEMES Co., a major Korean electronics equipment manufacturer
    • Joined the International Network of Korean Entrepreneurs (INKE)