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Semiconductor · Materials

Dicing Blade

Blades for package, quartz and wafer sawing. Metal, resin and electroplated hub types, plus forming wheels.

Establishment

      1. Established Intertek Engineering Co.
      1. Changed Company Name to Fine International Co.,Ltd.

Product Overview

  • Dicing Blades (2”, 3”, 4.5“, 5“) Metal Blade : Package & Quartz Sawing Resin Blade : QFN Package, Quartz, LED, Glass wafers & IR Filter Glass Sawing Electroplated Hub Blade : Wafer & Package Sawing
  • Forming Wheel : Micro SD Card Forming

Metal Blade

Resin Blade

Electroplated Hub Blade

  • Non ferrous powders

  • High bond strength

  • Lower rate of wear

  • Reduced round wear of blade edge

  • Excellent for semiconductor packages, ceramics, ferrite, soft glass and quartz

  • FRS Series (Soft Resin)

  • Excellent accuracy

  • Minimize chipping

  • No crack or crack propagations

  • Expect long blade life time

  • Nickel is plated

  • High accuracy in micro scale

  • Good grit exposure

  • Outstanding accuracy cutting ability

  • Excellent for cutting silicon and compound semiconductor and oxide wafer