Semiconductor · Equipment
OCR Bar Code, Wafer Mounter/Demount System
Reads wafer IDs by vision, prints barcode labels, and de-laminates tape without damaging the wafer.
Description and Main Function/Feature
Wafer OCR barcode print M/C
Prints Barcode Label After Read ID Mark for Wafer with Vision System and attaches in wafer frame or laminating film before wafer sawing. Applied Wafer : 6” , 8” . 8”, 12” ( Flat , Notch ) Feature : OCR ID Recognition 99.8%, ID & Label print position is set automatically
Wafer Demount System
Full Automatic De-Laminating system is designed to de-laminate tape (UV or Non UV) which is laminated on the wafer without any wafer Damage. This system is composed of, Wafer Cassette Loading module, Wafer aligner module, UV irradiator module, Wafer transfer robot, De-laminating module, Frame & base.
Wafer Tape Remover
After wafer back grained, this system has removed the laminating tape of Wafer’s Pattern surface Applied Wafer : 6” , 8” . 8”, 12” ( Flat , V NOTCH ) Feature : safety device to prevent wafer breakage. Force to maintain a constant angle and fitted pressure. Recording camera, Tape tension sensor
